Title:
DIE CUTTING DEVICE
Document Type and Number:
Japanese Patent JP3172995
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To share a metal mold for works different in property such as a material or the like by connecting a temperature control device for passing a temperature controlling fluid to a flow passage formed in such a manner as to pass a temperature control liquid in a die so that the vicinity of the hole part near a die becomes a designated temperature.
SOLUTION: Plural hole parts 21 are surrounded substantially like a square collectively from the outside to form a flow passage 31 for passing temperature control liquid such as water in the peripheral part in the die 18. A liquid supply source 32 for supplying temperature control liquid into the flow passage 31 is connected to the flow passage 31. The liquid supply source 32 controls the supply quantity and temperature of temperature control liquid by a control device 33. According to the temperature detected by a temperature sensor 34 provided in the vicinity of the hole part 21 of the die 18, the control device 33 controls the liquid supply source 32, whereby the temperature near the hole part 21 of the die 18 is adjusted to a designated temperature. Thus, a temperature control device 35 of the die can be constructed.
Inventors:
Maruyama, Masaki
Kiyono, Yoshihiro
Kiyono, Yoshihiro
Application Number:
JP1996000212380
Publication Date:
March 30, 2001
Filing Date:
August 12, 1996
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B26F1/14; B26F1/44; B30B15/34; B26F1/02; B26F1/38; B30B15/34; (IPC1-7): B26F1/44; B30B15/34
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