Title:
DIE ATTACHMENT/DETACHMENT DEVICE
Document Type and Number:
Japanese Patent JP2000094064
Kind Code:
A
Abstract:
To avoid the collision of a work with a die by smoothly and vertically moving an eject member.
In a die attachment/detachment device to attach/detach a die D to/from a die fitting hole 65 in a die holder 45 in a condition where the die D is held in the vertical direction by an eject member 47 to be vertically movable in the die holder 45 by a pushing-up means and a die press-down member which is vertically movable in the pressing-down means, a key insertion groove 79 and a slug hole 81 are formed in the eject member 47, and a communication hole 85 is formed in the die holder 45 so as to communicate therewith.
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Inventors:
KAWAGUCHI KOJI
SERIZAWA AKIHIRO
KATO FUMIO
SERIZAWA AKIHIRO
KATO FUMIO
Application Number:
JP26199598A
Publication Date:
April 04, 2000
Filing Date:
September 16, 1998
Export Citation:
Assignee:
AMADA CO LTD
International Classes:
B21D28/14; B21D28/34; B21D37/04; B21D37/14; (IPC1-7): B21D37/04; B21D28/14; B21D28/34; B21D37/14
Attorney, Agent or Firm:
Hidekazu Miyoshi (8 outside)
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