Title:
DIE DEVICE
Document Type and Number:
Japanese Patent JP2020127964
Kind Code:
A
Abstract:
To provide a die device capable of absorbing errors in a cushion pin length, parallelism on a press machine side and the like, simply at low cost, as well as, of achieving enhancement and stabilization in quality of formed products.SOLUTION: A die device 9 comprises: an upper die 1; a lower die 2; and a wrinkle suppressing die 3 positioned on the lower die 2 and held slidably in a forming direction via a slide plate 4. The die device press-forms a material, receiving pressure from a press machine cushion device 11 that drives to slide the wrinkle suppressing die 3 in a forming direction via cushion pins 6A, 6B abutting on a lower face of the wrinkle suppressing die 3. Gas springs 7A, 7B are disposed between the lower face of the wrinkle suppressing die 3 and top faces of the cushion pins 6A, 6B.SELECTED DRAWING: Figure 1
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Inventors:
MIZUNO YOSHIHISA
OGURA MASAKI
HIKE TAKESHI
ITO YOSUKE
OGURA MASAKI
HIKE TAKESHI
ITO YOSUKE
Application Number:
JP2019022489A
Publication Date:
August 27, 2020
Filing Date:
February 12, 2019
Export Citation:
Assignee:
SHINMEI IND CO LTD
International Classes:
B21D24/08
Domestic Patent References:
JPH07241625A | 1995-09-19 | |||
JP2009160591A | 2009-07-23 | |||
JP2016187816A | 2016-11-04 | |||
JP2004351431A | 2004-12-16 | |||
JP2001248676A | 2001-09-14 | |||
JPH0386397A | 1991-04-11 | |||
JPH0824960A | 1996-01-30 |
Foreign References:
EP0614711A1 | 1994-09-14 |
Attorney, Agent or Firm:
Hideo Fujimoto
Eiji Fujimoto
Nishimura Kojo
Eiji Fujimoto
Nishimura Kojo