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Patent Searching and Data


Title:
DIE EQUIPMENT
Document Type and Number:
Japanese Patent JPH0655228
Kind Code:
A
Abstract:

PURPOSE: To provide a die equipment which can reduce dispersion of the collar heights of through holes having a collar which are formed in metallic sheets as much as possible.

CONSTITUTION: In a die equipment, a through hole having a collar where the circumferential edge of the through hole is surrounded by the collar of the specified height at which tip the collar part is formed. The die equipment consists of an upper die set 10 and a lower die set 12 which are provided opposite to each other and at least one of them is provided in a vertically movable manner, and a lower die 64 which is provided on the lower die set 12 side and where the metallic sheet is loaded on the stage surface, and an upper die 62 which is provided on the upper die set 10. In addition, the die equipment consists of a pressing piece 66 which is arranged on the stage surface of the upper die 62, presses the collar part formed on the tip of the through hole having the collar in the metallic sheet loaded on the lower die 64, and stoppers 67, 68 which form a specified space between the stage surface of the upper die 62 and the stage surface of the lower die 64 when the upper die set 10 and the lower die set 12 are closed.


Inventors:
HONMA KENSAKU
SAKAGUCHI MASAHIDE
MIYAZAWA TOSHIKI
OKABE HIDEKI
Application Number:
JP23274292A
Publication Date:
March 01, 1994
Filing Date:
August 08, 1992
Export Citation:
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Assignee:
HIDAKA SEIKI KK
International Classes:
B21D19/00; B21D37/04; (IPC1-7): B21D19/00; B21D37/04
Attorney, Agent or Firm:
Takao Watanuki (1 outside)