Title:
DIE SUPPLY DEVICE
Document Type and Number:
Japanese Patent JP2022190593
Kind Code:
A
Abstract:
To appropriately recognize a position of a die at a die aggregate on the basis of imaging data.SOLUTION: A die supply device comprises: a holding stage for holding a die aggregate formed by dicing a wafer on which a dicing sheet is pasted; a push-up device that has a fluorescent body and pushes up any die of the die aggregate held by the holding stage from below; an irradiation device that radiates light to the fluorescent body; and an imaging device that images the die aggregate held by the holding stage from above in a state in which the fluorescent body is irradiated with light by the irradiation device.SELECTED DRAWING: Figure 9
Inventors:
IMANISHI SATOSHI
Application Number:
JP2021098986A
Publication Date:
December 26, 2022
Filing Date:
June 14, 2021
Export Citation:
Assignee:
FUJI CORP
International Classes:
H01L21/301; H01L21/67
Attorney, Agent or Firm:
Patent Attorney Corporation Next
Fukatsu Yasutaka
Yuki Kataoka
Fukatsu Yasutaka
Yuki Kataoka