To provide a die head capable of highly, precisely and easily adjusting a slit gap dimension evenly in the direction of a coating width.

A groove 11 for adjusting a gap is provided parallel with a slit gap 4 at the back of a slit face which forms the slit gap 4 of the die head 1. A gap adjusting device 13 for widening the groove width capable of widening the groove width by applying a voltage to laminated piezoelectric elements and a gap adjusting device 14 for reducing the groove width capable of reducing the groove width by applying a voltage to laminated piezoelectric elements are disposed in the groove so as to be adjustable in the direction of a coating width with respect to the position to be fixed; thus the slit gap dimension is evenly adjustable in the direction of the coating width by widening or reducing the groove width of the groove for adjusting the gap, which is done by applying a voltage to each of the laminated piezoelectric elements of the gap adjusting device 13 for widening the groove width and gap adjusting device 14 for reducing the groove width.