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Patent Searching and Data


Title:
DIE INFORMATION READING/WRITING METHOD AND APPARATUS FOR PUNCH PRESS DEVICE
Document Type and Number:
Japanese Patent JP2005138115
Kind Code:
A
Abstract:

To read/write the data on punching die information at every station highly precisely, and to reduce the reading/writing of the data from being troubled caused by metal powder and metal pieces.

In a punch press device 1, punching dies 3 and 5 for punching a work are mounted on die mounting holes 13 and 17 of die holders 9 and 11. Probe inserting hole parts 41 and 51 to communicate with the die mounting holes 13 and 17 via communication holes are formed in the die holders 9 and 11. In addition, an information tag 39 is attached to outer circumferences of the punching dies, and the punching dies are mounted in the die mounting holes 13 and 17 so that the information tag 39 faces the communication holes. When probes 45 and 55 having reader/writer 47 and 57 are inserted in the probe inserting hole parts 41 and 51, the distance between the reader/writer 47 and 57 and the information tag 39 is substantially constant across each communication hole, and the information tag 39 is easily read/written by the reader/writer 47 and 57 with high accuracy.


Inventors:
MORIKAWA HIROYUKI
Application Number:
JP2003374165A
Publication Date:
June 02, 2005
Filing Date:
November 04, 2003
Export Citation:
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Assignee:
AMADA CO LTD
International Classes:
B21D28/36; B21D37/00; G06K17/00; (IPC1-7): B21D28/36; B21D37/00; G06K17/00
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu