Title:
DIE FOR PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH08116157
Kind Code:
A
Abstract:
PURPOSE: To closely and uniformly press an entire surface of a printed wiring board whose surface is uneven because of formation of a printed wiring circuit.
CONSTITUTION: A printed wiring board 1 has a circuit formation part 8 which rises like a step because of formation of a printed wiring circuit. A recessed part 13 for absorbing a step of the circuit formation part 8 is formed in a press surface of a top force 10 for pressing a circuit formation surface of the printed wiring board 1.
Inventors:
KUBO ISAMU
Application Number:
JP8148391A
Publication Date:
May 07, 1996
Filing Date:
March 20, 1991
Export Citation:
Assignee:
NIPPON CMK KK
International Classes:
B25B1/24; H05K3/00; B26F1/02; H05K13/00; (IPC1-7): H05K3/00; B26F1/02
Attorney, Agent or Firm:
Takeshi Nara
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