Title:
DIE FOR PROCESSING METAL
Document Type and Number:
Japanese Patent JP2004330270
Kind Code:
A
Abstract:
To provide a die for processing a metal in which seizure does not occur in an non-lubricating state or when water is used as a lubricant.
The die for processing the metal is made of engineering plastic such as a polyamide (PA), aramid (PA), polyacetal (POM), polycarbonate (PC), thermoplastic polyester (TPEE), modified polyphenylene ether (m-PPE), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyether sulfone (PES), and polyetheretherketone (PEEK). The engineering plastic used for a die material has mechanical characteristics of a tensile strength of ≥ 50 MPa, an elongation of ≤ 30%, and Young's modulus of ≥ 2 GPa.
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Inventors:
HARADA TAISUKE
Application Number:
JP2003131863A
Publication Date:
November 25, 2004
Filing Date:
May 09, 2003
Export Citation:
Assignee:
JAPAN SCIENCE & TECH AGENCY
International Classes:
B21C25/00; B21C3/02; B21D37/01; (IPC1-7): B21D37/01; B21C3/02; B21C25/00
Domestic Patent References:
| JPH08243659A | 1996-09-24 | |||
| JPS63286239A | 1988-11-22 |
Attorney, Agent or Firm:
Wataru Ogura