Title:
DIE STRUCTURE, DIE MANUFACTURING METHOD, AND PRESS DIE
Document Type and Number:
Japanese Patent JP2003225718
Kind Code:
A
Abstract:
To provide a die structure capable of improving a machining accuracy of a shaft-fixing part of a punch, a die, etc., and a die manufacturing method, to shorten the machining time by providing a flange relief for locking the punch, the die, etc., only by the machining, and to easily form a hole of small diameter.
A fitting hole 18 to fix a shaft part 15a of a punch, a die or the like and a recessed part 19 with a flange part 15b thereof inserted therein are formed in plates 12 and 11 separate from each other. The fitting hole is obtained by expanding a prepared hole by the machining into a predetermined shape by the wire-EDM. The recessed part is obtained by machining a counter- sunk hole.
Inventors:
HIRASAWA EIJI
MACHIDA SEIJI
MACHIDA SEIJI
Application Number:
JP2002026658A
Publication Date:
August 12, 2003
Filing Date:
February 04, 2002
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B21D28/34; B21D37/14; B21D37/20; B21D43/00; (IPC1-7): B21D28/34; B21D37/14; B21D37/20; B21D43/00
Attorney, Agent or Firm:
Muneharu Sasaki (3 outside)
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