Title:
DIELECTRIC FILM, METHOD FOR FORMING DIELECTRIC LAYER USING THE SAME, AND SUBSTRATE FOR PLASMA DISPLAY PANEL USING DIELECTRIC MATERIAL
Document Type and Number:
Japanese Patent JP2005100892
Kind Code:
A
Abstract:
To provide a dielectric film, a dielectric layer and a substrate for a plasma display panel excellent in lamination property without defects due to bubbles, etc.
The dielectric film comprises a first supporting film (A), a dielectric layer (B) applied or formed on the film (A) and containing organic resin and glass powder which accounts for more than 70% by weight, and a second supporting film (C) overlayed on the dielectric layer (B). Adhesion of the dielectric layer (B) to the first supporting film (A) is made weaker than that to the second supporting film (C).
Inventors:
YAMADA NAOKI
TANAKA HIROYUKI
YAMAZAKI HIROSHI
TANAKA HIROYUKI
YAMAZAKI HIROSHI
Application Number:
JP2003335303A
Publication Date:
April 14, 2005
Filing Date:
September 26, 2003
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08J7/04; B32B7/02; B32B27/30; B32B27/36; H01J9/02; H01J11/22; H01J11/34; H01J11/38; C08L67/00; (IPC1-7): H01J9/02; B32B7/02; B32B27/30; B32B27/36; C08J7/04; H01J11/02
Domestic Patent References:
| JPH11149863A | 1999-06-02 | |||
| JPH11352682A | 1999-12-24 | |||
| JPH1116503A | 1999-01-22 | |||
| JP2002134006A | 2002-05-10 | |||
| JPH11109617A | 1999-04-23 | |||
| JP2001236888A | 2001-08-31 |