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Title:
誘電加熱成形装置及び誘電加熱成形方法
Document Type and Number:
Japanese Patent JP7175507
Kind Code:
B2
Abstract:
To provide a dielectric heating molding device 1 that can increase the degree of freedom in a size, shape or the like of a molded product to be molded, and a dielectric heating molding method.SOLUTION: A dielectric heating molding device 1 comprises a mold 2 and a dielectric heating source 6. The mold 2 is a material having an insulating property that generates heat due to dielectric loss, and has a cavity 20 in which a molded body 8 is molded from a molding material 80. The dielectric heating source 6 applies an alternating electric field Y to the molding material 80 and the molding die 2 in the cavity 20 by an AC voltage applied between a pair of electrodes 61 arranged on both sides of the mold 2 to heat the molding material 80 in the cavity 20.SELECTED DRAWING: Figure 3

Inventors:
Fumio Kurihara
Application Number:
JP2019211588A
Publication Date:
November 21, 2022
Filing Date:
November 22, 2019
Export Citation:
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Assignee:
Micro-AMS Co., Ltd.
International Classes:
B29C33/08
Domestic Patent References:
JP2048303U
JP4299106A
JP7241853A
JP2012086560A
JP2007181962A
JP2018167528A
JP61235114A
JP2012116023A
Attorney, Agent or Firm:
Patent Attorney Corporation Aichi International Patent Office