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Patent Searching and Data


Title:
DIELECTRIC PASTE AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2005011548
Kind Code:
A
Abstract:

To provide a dielectric paste, the viscosity of which is suppressed to a range of 0.5-50 poises made suitable in a circuit formation, etc., while securing dielectric constant generally considered to be in the range of 15 or larger for high dielectric constant and in which a barium titanate material surface treated by a specific silane coupling agent is mixed within an epoxy resin to eliminate a problem, such that if a large quantity of dielectric powder is added and the dielectric constant is increased, the viscosity of the dielectric paste increases and coating nature in circuit formation deteriorates.

This dielectric paste contains 75-30 vol% of epoxy resin, containing a curing agent and a hardening accelerator, and 25-70 vol% of the barium titanate material which is surface treated with γ-chloropropyltrimethoxy silane.


Inventors:
SENSO TOMOMITSU
MABUCHI TOSHIAKI
NAKATSUKA TORU
Application Number:
JP2003171172A
Publication Date:
January 13, 2005
Filing Date:
June 16, 2003
Export Citation:
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Assignee:
FUJIKURA LTD
International Classes:
H01B3/00; H01B3/12; H01B3/40; (IPC1-7): H01B3/00; H01B3/12; H01B3/40
Attorney, Agent or Firm:
Takeo Masuda