Title:
DIELECTRIC RESONATOR DEVICE AND ITS MOUNTING STRUCTURE
Document Type and Number:
Japanese Patent JP3198661
Kind Code:
B
Abstract:
PURPOSE: To prevent a solder bridge produced between an outer conductor and a signal input/output electrodes by forming the solder bumps to an outer conductor and the signal input/output electrode provided on the surface counter to a mounting substrate.
CONSTITUTION: An inner conductor is provided in a dielectric 1 and an outer conductor 4 is formed on the outer surface of the dielectric 1 together with a signal input/output electrode 9 which is connected to the inner conductor. Thus a dielectric resonator device is obtained. Then the solder bumps SB9 and SB10 are formed to the conductor 4 and the electrode 9 provided on the surface of the dielectric 1 counter to a mounting substrate. The dielectric resonator device is set at a prescribed position of the mounting substrate and the entire mounting substrate or a part of the dielectric resonator device is heated. As a result, both bumps SB9 and SB10 are melted and the surface mounting is made possible. Furthermore the solder overflow preventing films 20 are formed at both bumps to prevent solder overflowing to the undesired areas.
Inventors:
Ariyoshi, Akira
Application Number:
JP1992000275881
Publication Date:
June 15, 2001
Filing Date:
October 14, 1992
Export Citation:
Assignee:
MURATA MFG CO LTD
International Classes:
H01P1/205; H01P11/00; H05K1/02; H05K1/18; H05K3/34; (IPC1-7): H01P1/205; H01P11/00; H05K1/18
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