Title:
DIE, MULTILAYER EXTRUSION MOLDING APPARATUS, AND MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2023023731
Kind Code:
A
Abstract:
To provide a die, a multilayer extrusion molding apparatus, and a manufacturing method, for manufacturing a multilayer film, capable of effectively adjusting a thickness-ratio profile, and capable of easily changing a resin material and a thickness ratio.SOLUTION: A die for manufacturing a multilayer film provided with an outermost layer (A), an outermost layer (B), and one or more inner layers (C) provided between the outermost layers (A) and (B) comprises: a manifold (A) for the outermost layer that expands the width of a molten resin material (A); a manifold (B) for the outermost layer that expands the width of a molten resin material (B); a manifold (C) for the inner layer that expands the width of a molten resin material (C); a plurality of heaters (A) positioned at the outer side than the manifold (A); a plurality of heaters (B) positioned at the outer side than the manifold (B); a heat insulator (A) positioned between the manifold (C) and the heaters (A); and a heat insulator (B) positioned between the manifold (C) and the heaters (B).SELECTED DRAWING: Figure 1
Inventors:
HATA YUKI
Application Number:
JP2021129520A
Publication Date:
February 16, 2023
Filing Date:
August 06, 2021
Export Citation:
Assignee:
NIPPON ZEON CO
International Classes:
B29C48/31; B29C48/08; B29C48/21; B29C48/86; B29C48/92
Attorney, Agent or Firm:
Sakai International Patent Office