To provide a differential pressure and pressure measuring device whose withstand pressure is improved.

In a semiconductor pressure measuring device including a mold package having one plane connected to one plane of a semiconductor pressure sensor body, covering the other plane of the semiconductor pressure sensor body with a gap and made of mold material, a differential pressure and pressure measuring device includes: two pressure-resistant cover members of pressure resistance having a recessed part; a pressure-resistant cover formed by weldbonding opening parts of recessed parts to each other, in which the opening parts of the recessed parts of the pressure-resistant cover members are arranged oppositely and the mold package is arranged in the recessed parts with a gap; a signal extraction hole provided in the pressure-resistant cover to communicate with the gap; eight signal terminals concentratedly arranged in the signal extraction hole; and a filling body filled in the gap through the signal extraction hole and made of adhesive having a young's modulus larger than that of mold material of the mold package.