Title:
DIFFERENTIAL PRESSURE SENSOR AND METHOD FOR MANUFACTURING DIFFERENTIAL PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP2015219095
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve the pressure resistant performance of a sensor chip and relieve its thermal stress at the same time.SOLUTION: One top face of a sensor chip 1 (top face of a kovar pedestal 1-6) is joined to the upper inner wall surface of a sensor chamber 3 (inner wall surface of a first housing 2-1) via a first adhesive layer 7-1, and the other face of the sensor chip 1 (bottom face of a kovar pedestal 7-1) is joined to the lower inner wall surface (inner wall surface of a second housing 2-2) via a second adhesive layer 7-2. The first adhesive layer 7-1 is made to be an adhesive layer having a Young's modulus that is 1/1000 or less of the Young's modulus of a material constituting a sensor diaphragm 1-1, and the second adhesive layer 7-2 is made to be an adhesive layer having a Young's modulus that is 100 times or more of the Young's modulus of the first adhesive layer 7-1.
Inventors:
TSUSHIMA AYUMI
Application Number:
JP2014102510A
Publication Date:
December 07, 2015
Filing Date:
May 16, 2014
Export Citation:
Assignee:
AZBIL CORP
International Classes:
G01L13/02; G01L9/00; G01L9/04; H01L29/84
Domestic Patent References:
| JPH0688762A | 1994-03-29 | |||
| JP2012127781A | 2012-07-05 | |||
| JPH11295172A | 1999-10-29 | |||
| JP2011007533A | 2011-01-13 | |||
| JP6018486B2 | 2016-11-02 |
Foreign References:
| US20100122583A1 | 2010-05-20 | |||
| US20030005773A1 | 2003-01-09 |
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa