Title:
DIFFERENTIAL PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP2014102108
Kind Code:
A
Abstract:
To prevent the joint part of a sensor chip from being peeled.
The upper surface of a sensor chip 1 (the upper surface of a stopper member 1-2) is joined to an inner wall surface 2-1a in a sensor chamber 2-1 through an adhesive layer 4-1, and the lower surface of the sensor chip 1 (the lower surface of a stopper member 1-3) is joined to an inner wall surface 2-1b in the sensor chamber 2-1 through an adhesive layer 4-2. The adhesive layers 4-1 and 4-2 have a Young's modulus of 1/1000 or less to the Young's modulus of a material constituting a sensor diaphragm 1-1.
Inventors:
TANAKA TATSUO
ISHIKURA YOSHIYUKI
TOJO HIROSHI
TOKUDA TOMOHISA
SETO YUKI
KANAI AYUMI
ISHIKURA YOSHIYUKI
TOJO HIROSHI
TOKUDA TOMOHISA
SETO YUKI
KANAI AYUMI
Application Number:
JP2012252921A
Publication Date:
June 05, 2014
Filing Date:
November 19, 2012
Export Citation:
Assignee:
AZBIL CORP
International Classes:
G01L13/02
Domestic Patent References:
| JP2012127781A | 2012-07-05 | |||
| JP2012018049A | 2012-01-26 | |||
| JP2001349798A | 2001-12-21 | |||
| JP2005227137A | 2005-08-25 |
Foreign References:
| US20100122583A1 | 2010-05-20 |
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa
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