To completely prevent a joint part of a sensor chip from peeling and to achieve reduction in size by employing a simple structure.
In a meter body 12, a communication path (pressure lead path) 12g which guides measurement pressure P1 to a pressure reception diaphragm 14a for P1 protection and a communication path (pressure lead path) 12h which guides measurement pressure P2 to a pressure reception diaphragm 14b for P2 protection are formed. A space (recessed part 12e) on the back side of the pressure reception diaphragm 14a for P1 side protection and a sensor chamber are connected to each other by a communication path 12k and a space (recessed part 12f) on the back side of the pressure reception diaphragm 14b for P2 side protection and the sensor chamber are connected to each other by a communication path 12l; and a space including the recessed parts 12e, 12f, communication paths 12k, 12l, and sensor chamber together is defined as a sealed chamber and filled with a pressure transfer medium 20c.
TANAKA TATSUO
JPS63314431A | 1988-12-22 | |||
JPS62153547U | 1987-09-29 | |||
JPH0518838A | 1993-01-26 | |||
JPS63314431A | 1988-12-22 | |||
JPS62153547U | 1987-09-29 | |||
JPH0518838A | 1993-01-26 | |||
JP2013181949A | 2013-09-12 |
US20080257054A1 | 2008-10-23 | |||
US20080257054A1 | 2008-10-23 |
Shigeki Yamakawa
Next Patent: DIFFERENTIAL PRESSURE SENSOR