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Title:
DIFFERENTIAL PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP2014106182
Kind Code:
A
Abstract:

To completely prevent a joint part of a sensor chip from peeling and to achieve reduction in size by employing a simple structure.

In a meter body 12, a communication path (pressure lead path) 12g which guides measurement pressure P1 to a pressure reception diaphragm 14a for P1 protection and a communication path (pressure lead path) 12h which guides measurement pressure P2 to a pressure reception diaphragm 14b for P2 protection are formed. A space (recessed part 12e) on the back side of the pressure reception diaphragm 14a for P1 side protection and a sensor chamber are connected to each other by a communication path 12k and a space (recessed part 12f) on the back side of the pressure reception diaphragm 14b for P2 side protection and the sensor chamber are connected to each other by a communication path 12l; and a space including the recessed parts 12e, 12f, communication paths 12k, 12l, and sensor chamber together is defined as a sealed chamber and filled with a pressure transfer medium 20c.


Inventors:
ISHIKURA YOSHIYUKI
TANAKA TATSUO
Application Number:
JP2012260914A
Publication Date:
June 09, 2014
Filing Date:
November 29, 2012
Export Citation:
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Assignee:
AZBIL CORP
International Classes:
G01L13/02
Domestic Patent References:
JPS63314431A1988-12-22
JPS62153547U1987-09-29
JPH0518838A1993-01-26
JPS63314431A1988-12-22
JPS62153547U1987-09-29
JPH0518838A1993-01-26
JP2013181949A2013-09-12
Foreign References:
US20080257054A12008-10-23
US20080257054A12008-10-23
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa