To completely prevent a junction of a sensor chip from being peeled off.
A differential pressure transmitter is provided with: a P1 side protective pressure-receiving diaphragm 14a branching and receiving a measurement pressure P1; a P2 side protective pressure-receiving diaphragm 14b branching and receiving a measurement pressure P2; a P1 side protective pressure-receiving diaphragm stopper 15a; and a P2 side protective pressure-receiving diaphragm stopper 15b. A recess 12e formed as a space on the back side of the P1 side protective pressure-receiving diaphragm 14a and a sensor chamber 12a are connected to each other by a communication passage 12i, and a recess 12f formed as a space on the back side of the P2 side protective pressure-receiving diaphragm 14b and a sensor chamber 12a are connected to each other by a communication passage 12j. A space summing up the recesses 12e, 12f, the communication passages 12i, 12j, and the sensor chamber 12a is regarded as a sealing chamber, and the sealing chamber is filled with a pressure transmission medium 16c. Then, a relatively high measurement pressure of the measurement pressures P1, P2 is made to act in a direction toward a junction between a sensor chip 11 and a wall surface 12b of the sensor chamber 12a.
TANAKA TATSUO
TOJO HIROSHI
TOKUDA TOMOHISA
SETO YUKI
| JPS62153548U | 1987-09-29 | |||
| JPH0720539U | 1995-04-11 | |||
| JPH0518838A | 1993-01-26 | |||
| JPS62153548U | 1987-09-29 | |||
| JPH0720539U | 1995-04-11 | |||
| JPH0518838A | 1993-01-26 |
| US20080047127A1 | 2008-02-28 | |||
| US20080047127A1 | 2008-02-28 |
Shigeki Yamakawa
Next Patent: METHOD FOR ENCAPSULATING ENCAPSULATION LIQUID OF DIFFERENTIAL PRESSURE SENSOR