Title:
DIGITAL RADIATION SENSOR PACKAGE
Document Type and Number:
Japanese Patent JP2016042080
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide compact, high performance packaging designs.SOLUTION: A radiation sensing apparatus includes, in a vertically stacked configuration: a radiation sensor chip; an integrated circuit chip beneath the radiation sensor chip; and an optical element above the radiation sensor chip. The radiation sensor chip has a radiation sensing element and an electrically conductive contact coupled to the radiation sensing element and exposed at a lower surface. The integrated circuit chip has an integrated circuit and an electrical conductor coupled to the integrated circuit and exposed at an upper surface. The electrically conductive contact at the lower surface of the radiation sensor chip is physically and electrically coupled to the electrical conductor at the upper surface of the integrated circuit chip. The optical element is configured to pass incident and radiation at a wavelength that the radiation sensing element is configured to sense them.SELECTED DRAWING: Figure 1A
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Inventors:
ARTHUR JOHN BARLOW
ANAND PANDY
ANAND PANDY
Application Number:
JP2015153562A
Publication Date:
March 31, 2016
Filing Date:
August 03, 2015
Export Citation:
Assignee:
EXCELITAS TECHNOLOGIES SINGAPORE PTE LTD
International Classes:
G01J1/02; G01J1/04; H01L23/02
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
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