Title:
寸法計測装置、寸法計測方法及び半導体製造システム
Document Type and Number:
Japanese Patent JP7004826
Kind Code:
B2
Abstract:
The present disclosure relates to a dimension measuring device that shortens a time required for dimension measurement and eliminates errors caused by an operator. A dimension measuring device that measures a dimension of a measurement target using an input image is provided, in which a first image in which each region of the input image is labeled by region is generated by machine learning, an intermediate image including a marker indicating each region of the first image is generated based on the generated first image, a second image in which each region of the input image is labeled by region is generated based on the input image and the generated intermediate image, coordinates of a boundary line between adjacent regions are obtained by using the generated second image, coordinates of a feature point that defines a dimension condition of the measurement target are obtained by using the obtained coordinates of the boundary line, and the dimension of the measurement target is measured by using the obtained coordinates of the feature point.
Inventors:
Kohei Matsuda
Application Number:
JP2020537255A
Publication Date:
January 21, 2022
Filing Date:
August 07, 2019
Export Citation:
Assignee:
Hitachi High-Tech Co., Ltd.
International Classes:
G01B15/04; G01B15/00; H01L21/3065
Domestic Patent References:
| JP2017111816A | ||||
| JP2019087518A |
Attorney, Agent or Firm:
Patent Business Corporation Daiichi International Patent Office