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Title:
Dimple processing method
Document Type and Number:
Japanese Patent JP6085208
Kind Code:
B2
Inventors:
Kenji Nakajima
Naoya Fukagai
Application Number:
JP2013065317A
Publication Date:
February 22, 2017
Filing Date:
March 27, 2013
Export Citation:
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Assignee:
Hino Motors Ltd.
International Classes:
B23H3/04; B23H9/00; F02F1/00; F16J10/04
Domestic Patent References:
JP2003507197A
JP61268848A
JP59099072U
JP60047846A
JP6202325A
Attorney, Agent or Firm:
Yamada Patent Office



 
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