Title:
DIMPLING APPARATUS
Document Type and Number:
Japanese Patent JP2012223774
Kind Code:
A
Abstract:
To provide a dimpling apparatus which can be made compact as a whole apparatus.
The dimpling apparatus includes a ring-shaped member 31 having a ring hole 40 penetrating in the axial direction, and rotatable around the axis, a plurality of rotatable rollers which are arranged and held in the circumferential direction on an inner circumferential surface of the ring-shaped member 31, and a workpiece holding means for holding a workpiece so that the shaft-like workpiece is located in the ring hole 40 of the ring-shaped member 31. The ring-shaped member 31 is rotated around the axis to abut the plurality of rollers on an outer surface of the workpiece, consequently the outer surface of the workpiece is dimpled.
More Like This:
JP3300732 | METHOD AND APPARATUS FOR MAKING GROOVE IN ROTOR |
JPH06297067 | FORM ROLLING METHOD |
Inventors:
MATSUMOTO SHINSUKE
Application Number:
JP2011090670A
Publication Date:
November 15, 2012
Filing Date:
April 15, 2011
Export Citation:
Assignee:
MATSUMOTO KOGYO KK
International Classes:
B21H7/18
Domestic Patent References:
JP2000202556A | 2000-07-25 | |||
JP2004314169A | 2004-11-11 | |||
JP2009018379A | 2009-01-29 |
Foreign References:
GB198117B |
Attorney, Agent or Firm:
Ichiro Abe
Previous Patent: APPARATUS AND METHOD FOR SEMICONDUCTOR DEVICE
Next Patent: DAMPING CONTROL DEVICE, DAMPING CONTROL METHOD, AND COMPUTER PROGRAM
Next Patent: DAMPING CONTROL DEVICE, DAMPING CONTROL METHOD, AND COMPUTER PROGRAM