Title:
DIODE MODULE
Document Type and Number:
Japanese Patent JP3432432
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To widen a heat radiating surface, enhance heat radiating effects, and also obtain a small-sized surface mounting diode module in which an input terminal and an output terminal are disposed on one plane or two planes so as to be readily adapted to an external connector, by a method wherein triple diode chips of two types are disposed in parallel.
SOLUTION: A triple diode chip A having a common anode is connected to a metal electrode 5 at a common anode side, and three independent cathodes are connected to metal bars 1, 2, 3, respectively. A triple diode chip K having a common cathode is connected to a metal electrode 4 at a common cathode side, and three independent anodes are connected to the metal bars 1, 2, 3 together with the cathode of the chip A, respectively. The two triple diode chips A, K are disposed in parallel, and are sealed with a mold material 10 to form a diode module. Thus, it is possible to enhance heat radiating effects.
Inventors:
Hiromitsu Hayashi
Osamu Tsujimura
Osamu Tsujimura
Application Number:
JP30950398A
Publication Date:
August 04, 2003
Filing Date:
October 15, 1998
Export Citation:
Assignee:
Sansha Electric Co., Ltd.
International Classes:
H01L23/48; (IPC1-7): H01L23/48
Domestic Patent References:
| JP2131359U | ||||
| JP5353974U |
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