Title:
DIP COATING METHOD FOR CIRCULAR CYLINDRICAL SUBSTRATE
Document Type and Number:
Japanese Patent JP3654320
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method of applying dip coating on a plurality of circular cylindrical substrates in a single coating tank.
SOLUTION: In a method of coating a plurality of circular cylindrical substrates 6 by dipping the substrates 6 in a coating tank which a coating liquid overflows, the substrates are coated by supplying the coating liquid at such a rate that the coating liquid stops overflowing the coating tank 1 while the dipped circular cylindrical substrates 6 are being raised from inside the coating liquid 2, or supply of the coating liquid to the coating tank 1 is stopped and speed of raising the circular cylindrical substrates is changed while the dipped circular cylindrical substrates 6 are being raised from inside the coating liquid. As the circular cylindrical substrates 6, photosensitive drum substrates, developing sleeve substrates and the like are used.
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Inventors:
Yuichi Yashiki
Application Number:
JP13172096A
Publication Date:
June 02, 2005
Filing Date:
May 27, 1996
Export Citation:
Assignee:
Fuji Xerox Co., Ltd
International Classes:
G03G5/05; B05D1/18; B05D3/00; B05D7/00; (IPC1-7): B05D1/18; B05D3/00; B05D7/00; G03G5/05
Domestic Patent References:
| JP5088384A | ||||
| JP6262113A | ||||
| JP2173754A | ||||
| JP59046171A | ||||
| JP3059669A |
Attorney, Agent or Firm:
Tsuyoshi Watanabe
Yasuhiro Tanaka
Yasuhiro Tanaka