Title:
cis-1,4-ポリイソプレンからのディップ成形された医療用デバイス
Document Type and Number:
Japanese Patent JP4866528
Kind Code:
B2
Abstract:
Medical devices of synthetic rubber are prepared from cis-1,4-polyisoprene by dip molding without the use of sulfur-containing components. The devices have surprinsingly favorable tensile characteristics despite what is known in regard to synthetic cis-1,4-polyisoprene. In addition, the absence of both the proteins present in natural rubber and the sulfur components that are typically used in vulcanization of both natural rubber and cis-1,4-polyisoprene of the prior art renders the devices freely usable without causing the user to suffer Type I or Type IV allergic reactions that typically arise from contact with natural rubber.
Inventors:
McGlossulin, Mark W.
Scumid, Eric Buoy.
Scumid, Eric Buoy.
Application Number:
JP2001570127A
Publication Date:
February 01, 2012
Filing Date:
March 27, 2000
Export Citation:
Assignee:
Kimberly Clark Worldwide Incorporated
International Classes:
A41D19/00; A41D19/04; A61B19/04; A61L29/00; A61L31/00; A61M25/00; C08J3/24; C08J5/02; C08L9/00; A61F2/958
Domestic Patent References:
| JP255934U | ||||
| JP8253602A | ||||
| JP382463A | ||||
| JP822660A | ||||
| JP6256404A |
Foreign References:
| WO1998022036A1 | ||||
| WO2000011980A1 |
Attorney, Agent or Firm:
Yoichi Oshima