Title:
DIPPING DEVICE, DIE BONDING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023045346
Kind Code:
A
Abstract:
To provide a technique capable of forming a more uniform flux thin film.SOLUTION: A dipping device includes a squeegee device and a plate for forming a film of flux. A surface of the plate has a roughened surface of nanometer-level arithmetic mean roughness. The dipping device is configured to move the squeegee device and the plate relative to each other and supply the flux from the squeegee device to the roughened surface of the plate.SELECTED DRAWING: Figure 8
Inventors:
LEE GEONJU
SAKAI KAZUNOBU
KATO TAKAHIRO
SAKAI KAZUNOBU
KATO TAKAHIRO
Application Number:
JP2021153695A
Publication Date:
April 03, 2023
Filing Date:
September 22, 2021
Export Citation:
Assignee:
FASFORD TECH CO LTD
International Classes:
H01L21/60
Attorney, Agent or Firm:
Polar Patent Attorney Corporation
Previous Patent: Seal member position measuring machine
Next Patent: Program and information processing method
Next Patent: Program and information processing method