To obtain a dipping coating material improved in both mechanical strength and curability while retaining its resin content, thus extremely suitable for electrical and electronic parts, essentialy containing an aniline-modified phenolic resin and an epoxy resin.

This coating material essentially contains (A) an anilinemodified phenolic resin and (B) an epoxy resin (pref. cresol novolak-type epoxy resin ≤500 in epoxy equivalent). The component A is obtained, in general, by reaction between a phenolic compound and an aldehyde in the presence of aniline and a divalent metal oxide or hydroxide. It is preferable that the aniline modification rate is 0.1-0.4mol per mol of the phenolic compound. Normally, the resin, the component A and the component B account for 5-50wt.%, 3-25wt.%, and 2-25wt.% of the whole coating composition, respectively. The weight ratio A/B is normally 100:(40-140). Besides, it is preferable that this coating material also contain silica as filter and a coupling agent.