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Title:
Directions for use, such as a hardenability poly silsesquioxane compound, its manufacturing method, a hardenability constituent, a hardened material, and a hardenability constituent
Document Type and Number:
Japanese Patent JP5981668
Kind Code:
B2
Abstract:
The present invention is a curable polysilsesquioxane compound comprising at least one structural unit represented by CHR 1 X 0 -D-SiO 3/2 , the curable polysilsesquioxane compound having a 29 Si nuclear magnetic resonance spectrum that has a first peak top within a range of -73 ppm or more and less than -65 ppm, has a second peak top within a range of -82 ppm or more and less than -73 ppm, and substantially does not have a peak within a range of -65 ppm or more and less than -55 ppm, and a method for producing the curable polysilsesquioxane compound, and a curable composition comprising the curable polysilsesquioxane compound and a silane coupling agent, and a cured product obtained by heating the curable composition, and a method for using the curable polysilsesquioxane compound or the curable composition , as an optical device-securing material.

Inventors:
Matsui Yumi
Mikihiro Kashio
Application Number:
JP2015559057A
Publication Date:
August 31, 2016
Filing Date:
May 07, 2015
Export Citation:
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Assignee:
LINTEC CORPORATION
International Classes:
C08G77/22; C08K5/54; C08L83/08; H01L23/29; H01L23/31; H01L33/52
Domestic Patent References:
JP2012197425A2012-10-18
JP2008179811A2008-08-07
JP2012197425A2012-10-18
JP2008179811A2008-08-07
Foreign References:
WO2012141360A12012-10-18
WO2012073988A12012-06-07
WO2011111673A12011-09-15
WO2012141360A12012-10-18
WO2012073988A12012-06-07
WO2011111673A12011-09-15
Attorney, Agent or Firm:
Haruhito Oishi



 
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