Title:
COPPER INTERCONNECTION OF METAL SEED LAYER INSERTION STRUCTURE
Document Type and Number:
Japanese Patent JP3121589
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an interconnected structure of copper alloys having improved electromigration resistance force, adhesion and other surface characteristics.
SOLUTION: Copper conductor bodies 56 and 60 and a copper alloy or metal seed layer 76 disposed between the copper conductor bodies and an electronic device are utilized to provide a novel interconnected structure for establishing electrical communication with the electronic device. In order to improve the electromigration resistance force, an adhesion property to a barrier layer, device surface characteristics or an adhesion process, copper-based seed layers of various decompositions or a specific metal seed layer can be used according to each purpose.
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Inventors:
Daniel Charles Edlasten
James McKell Edwin Harper
Chao Kung
Andrew H. Simon
Coplein Emeca Uzo
James McKell Edwin Harper
Chao Kung
Andrew H. Simon
Coplein Emeca Uzo
Application Number:
JP11751399A
Publication Date:
January 09, 2001
Filing Date:
April 26, 1999
Export Citation:
Assignee:
International Business Machines Corporation
International Classes:
H01L23/52; H01L21/3205; H01L21/768; H01L23/532; (IPC1-7): H01L21/3205
Domestic Patent References:
| JP920942A | ||||
| JP8102463A | ||||
| JP547760A | ||||
| JP9186157A | ||||
| JP8298285A | ||||
| JP1154458A | ||||
| JP10223635A | ||||
| JP1145887A |
Attorney, Agent or Firm:
Hiroshi Sakaguchi (1 person outside)