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Title:
ディスク基板成形装置、ディスク基板成形方法及びディスク基板成形用金型
Document Type and Number:
Japanese Patent JP5650641
Kind Code:
B2
Abstract:
A disk substrate molding apparatus has a disk substrate molding die and a temperature controller. The disk substrate molding die includes a stamper, a first die including a mirror member to which the stamper comes in contact, and a second die including a molding surface which forms a disk-shaped cavity between the molding surface and the stamper. The second die includes a protruding part which protrudes toward the stamper at an outer circumferential part of the molding surface. The temperature controller controls temperature of the second die so that the protruding part exhibits a higher temperature in comparison to a region further toward the inner circumferential side than the protruding part, and controls temperature of the first die so that a region opposite to the protruding part exhibits a lower temperature in comparison to the protruding part in the mirror member.

Inventors:
井上 和夫
Application Number:
JP2011513807A
Publication Date:
January 07, 2015
Filing Date:
September 01, 2010
Export Citation:
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Assignee:
パナソニックIPマネジメント株式会社
International Classes:
B29C45/73; B29C33/02; B29C45/26; B29C45/70; G11B7/26
Domestic Patent References:
JP2007083653A2007-04-05
JPH09295319A1997-11-18
JPH09314563A1997-12-09
JP2000015644A2000-01-18
JP2007083653A2007-04-05
JPH09295319A1997-11-18
JPH09314563A1997-12-09
JP2000015644A2000-01-18
Foreign References:
WO2007099732A12007-09-07
WO2007099732A12007-09-07
Attorney, Agent or Firm:
Etsuji Kotani
Otari 昌崇
Sprig of a sacred tree Yukihisa