Title:
DISCHARGE AUXILIARY TYPE LASER HOLE MACHINING DEVICE
Document Type and Number:
Japanese Patent JP2014226695
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a discharge auxiliary type laser hole machining device which prevents machining chips from attaching to a laser optical system during through hole forming processing.SOLUTION: A discharge auxiliary type laser hole machining device forms a plurality of through holes on an insulating substrate by laser beam irradiation, and adjusts a shape of the through hole by a discharge phenomenon between first and second electrodes. The device includes a laser light source which radiates a laser beam, a laser optical system which irradiates a through hole forming position on the insulating substrate with the laser beam as an irradiation laser beam, and the first and second electrodes which generate discharge. The laser optical system includes a protection cover on an outlet side of the irradiation laser beam. The discharge auxiliary type laser hole machining device includes air flow generating means which generates an air flow on an emission side of the irradiation laser beam of the protection cover, and sucking means which sucks machining chips generated from the insulating substrate.
Inventors:
MORI SHIGETOSHI
Application Number:
JP2013108155A
Publication Date:
December 08, 2014
Filing Date:
May 22, 2013
Export Citation:
Assignee:
ASAHI GLASS CO LTD
International Classes:
B23K26/142; B23H7/38; B23H9/14; B23K26/382; B23K26/60; B23K26/70
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito