Title:
DISCHARGE AUXILIARY TYPE LASER HOLE MACHINING METHOD, AND METHOD OF MANUFACTURING INSULATING SUBSTRATE HAVING THROUGH HOLE
Document Type and Number:
Japanese Patent JP2014226715
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a discharge auxiliary type laser hole machining method which can significantly suppress a projection generated around an opening of a through hole after machining as compared with a conventional one.SOLUTION: A discharge auxiliary type laser hole machining method forms a plurality of through holes on an insulating substrate by laser beam irradiation, and adjusts a shape of the through hole by a discharge phenomenon between first and second electrodes. The discharge auxiliary type laser hole machining method forms the through hole in an irradiation region of the insulating substrate by irradiating the insulating substrate with a laser beam, and then a DC voltage is applied between the first and second electrodes before power of the laser beam in the irradiation region becomes zero to generate discharge in the irradiation region.
Inventors:
WATANABE MITSURU
Application Number:
JP2013110601A
Publication Date:
December 08, 2014
Filing Date:
May 27, 2013
Export Citation:
Assignee:
ASAHI GLASS CO LTD
International Classes:
B23K26/382; B23H7/38; B23H9/14; B23K26/60; B23K26/70; C03B33/09
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito
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