To provide a discharge plasma processing method that can control with high accuracy by equally distributing, with less control valves, the introducing quantity of a processing gas to the introducing piping for an electrode structure of a plurality of remote devices.

In the discharge plasma processing method for processing an workpiece outside a discharge space using an electrode structure for generating glow discharge plasma by applying an electric field through the introduction of a processing gas between a pair of electrodes, at least one face of counter electrodes is covered with a solid dielectric. The method is characterized by the control in which, with more than one electrode structure, the introducing quantity of the processing gas into the plurality of electrode structures is adjusted with the control valves, the number of which is smaller by one than that of the processing gas introducing pipings for each electrode structure, so that the gas flow rate of the entire pipings is equalized.