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Title:
DISCHARGE PLASMA TREATMENT METHOD AND DISCHARGE PLASMA TREATMENT DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2004089859
Kind Code:
A
Abstract:

To stably treat a long substrate to be treated by introducing a treating gas at a prescribed flow rate only into the space between a pair of opposed electrodes whose opposed surfaces are convex.

The surfaces of a pair of fixed electrodes 2, 3 arranged opposite to each other in the vertical direction are coated with a fixed dielectric substance 7, 8 and a discharge space 4 is formed between them. A gas supply nozzle 5 and a gas exhaust nozzle 6 are disposed on both sides of the discharge space and a treating gas is blown from the outlet of the gas supply nozzle 5 into the discharge space 4 in an arrow direction at a prescribed rate (preferably about 1-50 m/sec, more preferably 2-20 m/sec). When an electric field is applied from a power source 1 between the electrodes 2, 3, the treating gas is converted to plasma in the discharge space 4 to treat the surface of a substrate 10 to be treated during transport between the electrodes 2, 3.


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Inventors:
IWANE KAZUYOSHI
Application Number:
JP2002254620A
Publication Date:
March 25, 2004
Filing Date:
August 30, 2002
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H05H1/24; B01J19/08; C08J7/00; C23C16/455; (IPC1-7): B01J19/08; C08J7/00; C23C16/455; H05H1/24