PURPOSE: To make it possible to discriminate chips after chip dicing by adding a characteristic symbol to each semiconductor device.

CONSTITUTION: A semiconductor device is formed by repeating film forming, photoetching and impurity diffusion on a semiconductor substrate water 1. Next, electrode wiring is performed, after which a protective film is covered, and electrode terminals are formed by photoetching. In a photo process in which electrode terminals are formed, a characteristic symbol 3 is lithographed to the region in the semiconductor chip 2 except semiconductor elements at the same time as the patterning of element regions of the semiconductor device or the element region is lithographed, and etching is performed after development.