To provide a disk polishing apparatus capable of simultaneously polishing a plurality of disks, having superior work efficiency, and capable of reducing the work of an operator.

The apparatus is provided with a rotary part having a plurality of turntables on which the disks are mounted and a plurality of polishing means whose polishing surfaces for polishing the surfaces of the disks are downwardly directed. The turntables are radially arranged from the axis of rotation of the rotary part at a prescribed interval. The plurality of polishing means are arranged at the prescribed interval above turntable passing circles. The turntables on which the disks are mounted are moved below the polishing means by the rotation of the rotary part at the prescribed interval, and the polishing means simultaneously polishes the plurality of disks mounted on the turntables.