Title:
ディスクのセグメント設計
Document Type and Number:
Japanese Patent JP7368492
Kind Code:
B2
Abstract:
A pad conditioner and chemical mechanical planarization (CMP) pad conditioner assembly for a CMP assembly are disclosed. The pad conditioner includes a substrate having a first surface and a second surface opposite the first surface. A plurality of protrusions protrude away from the first surface in a direction that is normal to the first surface. The plurality of protrusions are arranged in a plurality of rows. A first row of the plurality of rows is offset from a second row of the plurality of rows.
Inventors:
Jenner, Dork
Sriaga, Conrad
Souza, Joseph
All, roundy
Rivers, Joseph
Bar, Elango
Sriaga, Conrad
Souza, Joseph
All, roundy
Rivers, Joseph
Bar, Elango
Application Number:
JP2021559542A
Publication Date:
October 24, 2023
Filing Date:
April 08, 2020
Export Citation:
Assignee:
Entegris Incorporated
International Classes:
B24B53/12; B24B53/017; H01L21/304
Domestic Patent References:
| JP2018032745A | ||||
| JP2014510645A |
Attorney, Agent or Firm:
Sonoda & Kobayashi Patent Attorneys Corporation