DISPENSER FOR BONDING ELECTRONIC COMPONENT

Japanese Patent JP2022082476

A

To provide a dispenser for bonding an electronic component which can discharge an optimum amount of an adhesive to a narrow area with high accuracy.SOLUTION: A dispenser 100 for bonding an electronic component of the invention includes: an adhesive storage container 110 in which an adhesive is stored; a nozzle 1 provided at a tip of the adhesive storage container; an extrusion pin 120 which may move vertically in the adhesive storage container; and a pressure member 130 which applies an extrusion pressure to the extrusion pin. The nozzle includes: a body; an internal space 111 which is provided within the body and to which the adhesive is supplied; and a through hole for discharge which is provided directed from the internal space to a tip of the body. The through hole for discharge has: an injection inlet into which the adhesive from the internal space is injected; and a discharge outlet from which the adhesive from the internal space is discharged to the outside. The adhesive supplied to the internal space receives a discharge pressure applied by extrusion of the extrusion pin to be injected into the injection inlet, passes through the through hole for discharge, and is discharged from the discharge outlet.SELECTED DRAWING: Figure 1

MIENO KEIJI

JP2020193918A

June 02, 2022

November 21, 2020

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WORKS CO LTD

B05C5/00; B05B1/02; B05C11/10; C09J5/00; C09J201/00; H01L21/52

JP2019058886A	2019-04-18
JP2008029920A	2008-02-14
JP2003181326A	2003-07-02
JP2016000392A	2016-01-07
JP2018101815A	2018-06-28
JP2005334733A	2005-12-08

CN102328074A

2012-01-25

Mizoguchi

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