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Patent Searching and Data


Title:
DISPERSANT FOR SUSPENSION POLYMERIZATION OF VINYL COMPOUND
Document Type and Number:
Japanese Patent JP2004131592
Kind Code:
A
Abstract:

To provide a dispersant for suspension polymerization of a vinyl compound enabling the polymerization to be made stably and giving vinyl polymer beads which are high in bulk density, have a granular structure of high porosity, are sharp in size distribution and are good in processability.

The dispersant comprises a water-soluble polyvinyl ester resin which is 1.5-80 mPa.s in its 4 wt% aqueous solution viscosity at 20°C and contains oxyalkylene group(s) on the end or in the molecular chain.


Inventors:
MATSUOKA TOSHIFUMI
OHARADA AKINOBU
Application Number:
JP2002297446A
Publication Date:
April 30, 2004
Filing Date:
October 10, 2002
Export Citation:
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Assignee:
JAPAN VAM & POVAL CO LTD
International Classes:
C08F2/20; C08F218/04; C08F290/06; (IPC1-7): C08F2/20; C08F218/04; C08F290/06
Attorney, Agent or Firm:
Ryu Iwatani