Title:
DISPERSION, ADHESIVE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING DISPERSION
Document Type and Number:
Japanese Patent JP2023135149
Kind Code:
A
Abstract:
To provide a dispersion having excellent adhesiveness and dispersibility, an adhesive composition containing the dispersion, a laminate obtained using the dispersion, and a method for producing the dispersion.SOLUTION: The dispersion contains an ethylene-(meth)acrylic acid-(meth)acrylate copolymer (A), a basic compound (B), an organic solvent (C), and water (D). The content ratio of a structural unit derived from (meth)acrylic acid is 6 mass% or more and 11 mass% or less based on the total amount of the ethylene-(meth)acrylic acid-(meth)acrylate copolymer (A). The organic solvent (C) has a dielectric constant at 25°C of 7.0 or more and 37.0 or less. The content ratio of the organic solvent (C) is 1 mass% or more and 45 mass% or less based on the total amount of the organic solvent (C) and the water (D).SELECTED DRAWING: None
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Inventors:
HAYAMI ARASHI
ANDO KAZUHIRO
OMURA KAZUHIRO
KUSUMOTO SEIYA
ANDO KAZUHIRO
OMURA KAZUHIRO
KUSUMOTO SEIYA
Application Number:
JP2022040213A
Publication Date:
September 28, 2023
Filing Date:
March 15, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L33/10; B32B27/32; C09J11/04; C09J11/06; C09J123/08
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda
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