Title:
分散体並びにこれを用いた導電性パターン付構造体の製造方法及び導電性パターン付構造体
Document Type and Number:
Japanese Patent JP7104687
Kind Code:
B2
Abstract:
A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).0.0001≤reductantmass/copperoxidemass≤0.100.0050≤dispersingagentmass/copperoxidemass≤0.30The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.
Inventors:
Eiichi Ohno
Toru Yumoto
Masanori Tsuruta
Toru Yumoto
Masanori Tsuruta
Application Number:
JP2019506270A
Publication Date:
July 21, 2022
Filing Date:
March 15, 2018
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
H01B1/22; H01B13/00; H05K1/09; H05K3/12
Domestic Patent References:
| JP20158136A | ||||
| JP2004253794A | ||||
| JP2004119686A | ||||
| JP2009283547A |
Foreign References:
| WO2015012264A1 | ||||
| EP3127969A1 | ||||
| WO2014119498A1 |
Attorney, Agent or Firm:
Aoki Atsushi
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma
Shinji Mihashi
Kazuhiro Nakamura
Saito Tsuko
Shunsuke Sanma