Title:
金属性、金属酸化物又は金属前駆体ナノ粒子、高分子分散剤及び焼結助剤を含んでなる分散系
Document Type and Number:
Japanese Patent JP5870203
Kind Code:
B2
Abstract:
The present invention relates to conductive compositions comprising a specific carboxylic acid as sintering additive. It further relates to a method to prepare such compositions. The compositions of the present invention allow a reduction of the curing time and/or a lowering of the curing temperature when applied to a substrate. Thus, the present invention also relates to a process for curing said conductive compositions and to coated layers or patterns thereof. The present invention is useful to apply conductive compositions on various substrates including thermo-sensitive substrates having a melting point below 200°C and to speed up processes for making conductive layers and/or patterns by substantially reducing the curing times.
Inventors:
Andre, Xavier
Boren, Daleuk
Boren, Daleuk
Application Number:
JP2014542896A
Publication Date:
February 24, 2016
Filing Date:
December 18, 2012
Export Citation:
Assignee:
Aghua-Gevert
International Classes:
C08L59/04; C08G65/26; C08K3/22; C08K5/092; C08L71/02; C09D1/00; C09D5/24; C09D7/12; C09D11/52; C09K23/42; H01B1/20; H01B5/14; H01B13/00; H05K1/09
Domestic Patent References:
| JP2007182547A | ||||
| JP2009532522A |
Foreign References:
| WO2011052966A1 | ||||
| WO2007129748A1 |
Attorney, Agent or Firm:
Patent business corporation Odashima patent office
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