Title:
結合された光および電子ビーム技術を使用する位置ずれ測定
Document Type and Number:
Japanese Patent JP7317131
Kind Code:
B2
Abstract:
A misregistration metrology system useful in manufacturing semiconductor device wafers including an optical misregistration metrology tool configured to measure misregistration at at least one target between two layers of a semiconductor device which is selected from a batch of semiconductor device wafers which are intended to be identical, an electron beam misregistration metrology tool configured to measure misregistration at the at least one target between two layers of a semiconductor device which is selected from the batch and a combiner operative to combine outputs of the optical misregistration metrology tool and the electron beam misregistration metrology tool to provide a combined misregistration metric.
Inventors:
Volkovich Royer
Jerschami Ryan
Goodman Nadab
Jerschami Ryan
Goodman Nadab
Application Number:
JP2021547481A
Publication Date:
July 28, 2023
Filing Date:
June 04, 2019
Export Citation:
Assignee:
KLA Corporation
International Classes:
H01L21/66; G01B11/00
Domestic Patent References:
| JP2018519543A | ||||
| JP2005518107A | ||||
| JP2015532733A | ||||
| JP201519055A |
Foreign References:
| WO2004107415A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation YKI International Patent Office