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Title:
表示バックプレート及びその製作方法、表示パネル及びその製作方法、表示装置
Document Type and Number:
Japanese Patent JP7464541
Kind Code:
B2
Abstract:
A display backplate and a method for manufacturing the same, a display panel and a method for manufacturing the same, and a display device are provided. The display backplate includes an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

Inventors:
梁 志▲偉▼
▲羅▼ ▲ウェン▼▲倩▼
▲劉▼ 英▲偉▼
King
姚 ▲チ▼
Wang Huijuan
李 ▲海▼旭
曹 占▲鋒▼
袁 ▲廣▼才
Study
王 国▲強▼
▲呂▼ 志▲軍▼
Application Number:
JP2020570165A
Publication Date:
April 09, 2024
Filing Date:
May 31, 2019
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO.,LTD.
International Classes:
G09F9/30; G09F9/00; G09F9/33; H01L33/00; H05K3/32
Domestic Patent References:
JP2008027933A
JP2019079985A
JP2018101785A
JP2019507904A
Foreign References:
CN109494292A
US20190157532
US20180175268
CN108206234A
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mihiro