表示装置の製造方法及び表示装置の製造装置

Japanese Patent JP5181274

B2

[PROBLEM] A thin film laminated substrate is cut by a laser beam under certain conditions, so that a cut surface which is sufficient for a display apparatus can be obtained without damaging the thin film laminated substrate, and the cutting is enabled by a low-output inexpensive apparatus, so that a reduction in cost can be expected. [Solving Means] In a display apparatus manufacturing method for emitting a laser beam 43 to the thin film laminate substrate 1 to be used for the display apparatus so as to cut the thin film laminated substrate 1, machining conditions of the laser beam are such that an output of the laser beam is 12 to 18 W, a cutting speed of the laser beam is 130 to 170 mm/sec. and the number of repetitive emitting times of the laser beam is 10 to 15 times, and the laser beam 43 is emitted from at least one surface of the thin film laminated substrate 1 so that the thin film laminated substrate 1 is cut.

JPS5260642	LIQUID CRYSTAL DISPLAY
JPH0611677	INSPECTION METHOD FOR LIQUID CRYSTAL DISPLAY PANEL
JP6985275	Liquid crystal mixture

Atsuo Nozaki
Shigeyoshi Otsuki

JP2007546957A

April 10, 2013

July 31, 2006

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KURARAY CO.,LTD.
JSR CORPORATION
Sumitomo Chemical Co., Ltd.
Sumitomo Bakelite Co., Ltd.
Dai Nippon Printing Co.,Ltd.
Toppan Printing Co., Ltd.
NEC
Hitachi Chemical Co., Ltd.

G02F1/13; B23K26/38; B23K26/40; G02F1/1333; G09F9/00

JP2006003761A	2006-01-05
JP2000267060A	2000-09-29
JP2005212364A	2005-08-11
JP2005292420A	2005-10-20
JP2000326295A	2000-11-28
JP3206116B2	2001-09-04
JP2006003830A	2006-01-05
JP2002229479A	2002-08-14

Toshio Tsuruwaka

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