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Patent Searching and Data


Title:
DISTRIBUTED CAPACITIVE CIRCUIT ELEMENT
Document Type and Number:
Japanese Patent JPH10199756
Kind Code:
A
Abstract:

To provide a DC interface at a low cost which is used in a circuit module, and can reduced the manufacturing cost and the size of a module.

In an embodiment, a lossy capacitive circuit element, i.e., a DC scrubber 12 is provided which is printed on a circuit board 14 and filters out high frequency signals in a circuit module. Upper conductor 26 of the DC scrubber 12 is isolated from ground conductor 22 by a layer 24 of high permitivity material. Resistance layers 28, 29 arranged above or below the upper conductor 26 absorb a high frequency signal applied to the upper conductor 26, and the dielectric layer branches the signal into the ground conductor 22. In another embodiment, a pair of DC scrubber are vertically stacked and form a parallel lossy capacitive structure.


Inventors:
BARNETT RON
CASEY JOHN F
Application Number:
JP29541197A
Publication Date:
July 31, 1998
Filing Date:
October 28, 1997
Export Citation:
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Assignee:
HEWLETT PACKARD CO
International Classes:
H01G4/33; H01C1/02; H01C7/00; H01G4/35; H01G4/40; H03H1/02; H03H7/01; H05K1/16; (IPC1-7): H01G4/35; H01G4/33; H01G4/40
Attorney, Agent or Firm:
Hideo Ueno