Title:
基板の化学及び／又は電解表面処理用の処理流体のための分配体
Document Type and Number:
Japanese Patent JP7321369
Kind Code:
B2
Abstract:
The invention relates to a distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution system for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of a distribution body or a distribution system for a chemical and/or electrolytic surface treatment of a substrate in a process fluid and a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a substrate.The distribution body comprises: a front face, a rear face, at least an inlet, an outlet array, and a flow control array. The front face is configured to be directed towards the substrate for the surface treatment of the substrate. The rear face is arranged opposite to the front face. The inlet is configured for an entry of the process fluid into the distribution body. The outlet array comprises several outlets, which are configured for an exit of the process fluid out of the distribution body and towards the substrate. The flow control array is arranged upstream of the outlet array with respect to a flow of the process fluid and comprises several flow control elements.
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Inventors:
Andreas Gleissner
Philip Engesser
Harald O'Korn-Schmidt
Philip Engesser
Harald O'Korn-Schmidt
Application Number:
JP2022520136A
Publication Date:
August 04, 2023
Filing Date:
November 18, 2020
Export Citation:
Assignee:
SEMSYSCO GmbH
International Classes:
C25D21/10; C25D5/08; C25D17/00
Domestic Patent References:
| JP201949046A | ||||
| JP201158034A | ||||
| JP5789495A |
Foreign References:
| US20150129418 | ||||
| US20090272644 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Uehara Makoto
Mitsutsugu Sugimura
Uehara Makoto