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Title:
DIVIDED BODIES FOR FORMING RESIN MOLDED PRODUCT, AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT, AND HEAT EXCHANGER
Document Type and Number:
Japanese Patent JP2013107227
Kind Code:
A
Abstract:

To provide divided bodies for forming a resin molded product that has higher accuracy for positioning of bonding surfaces relative to each other than the prior art.

The divided bodies for forming a resin molded product are a pair of divided bodies 2 and 3 for forming a resin molded product by being superimposed on one another and then subjected to vibration welding. Each of the pair of divided bodies 2 and 3 has a bonding surface 40 for abutment with each other. The bonding surface 40 is provided with a protrusion and recess that form a line pattern parallel in a specific direction, and allows the pair of divided bodies 2 and 3 to move relative to each other along the specific direction when the pair of divided bodies 2 and 3 are superimposed on one another and engage with each other.


Inventors:
MACHIDA HIRONORI
SUZUKI MOTOHIRO
Application Number:
JP2011252215A
Publication Date:
June 06, 2013
Filing Date:
November 18, 2011
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
B29C65/08; F28F3/12
Domestic Patent References:
JP2004306522A2004-11-04
JP2008508497A2008-03-21
JPH0985827A1997-03-31
JPS50115267U1975-09-19
Attorney, Agent or Firm:
Koichi Kamata
Noriaki Aso



 
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